Wafer-to-Wafer
Bonding System
Extreme Precision for Advanced Packaging
he ASMO Advanced Wafer-to-Wafer Bonding System is engineered for next-generation 3D IC and advanced packaging technologies.
By integrating high-precision alignment, stable bonding control, and multi-process capability, the system delivers industry-leading bonding quality and process reliability.
Optimized for high-density interconnect (HDI), heterogeneous integration, and chiplet architectures, ASMO provides a complete solution from R&D to mass production.
Multi-Process Bonding Capability
Supports a wide range of bonding technologies:
• Thermo-Compression Bonding
• Eutectic Bonding
• Anodic Bonding
• Direct / Fusion Bonding
• Surface Activated Bonding (Low Temperature)
One platform for multiple process requirements
High Stability Process Control
Precise control of key parameters:
• Bonding force: up to 50 kN
• Temperature: up to 450–550°C
• Vacuum level: 10⁻⁵ mbar class
Ensuring high yield and process consistency.
Production-Ready Platform
• Supports 300 mm wafers
• Compatible with EFEM / FOUP automation
• Supports SECS/GEM and MES integration
Fully ready for semiconductor fab environments
Flagship Specifications
• Supports 300 mm wafers
• Compatible with EFEM / FOUP automation
• Supports SECS/GEM and MES integration
Fully ready for semiconductor fab environments
Flagship Specifications
Applications
• 3D IC / Chiplet Integration • Advanced Packaging（Fan-Out / 2.5D / 3D） • CMOS Image Sensor（CIS）
• MEMS / Sensor Integration • Heterogeneous Integration
Market Position
Compared to global leading equipment suppliers, ASMO offers:：
• Comparable technical performance • Superior cost-performance ratio • Flexible customization • Faster delivery and local support
※A competitive solution for advanced packaging markets