ASMO Technology Co.,LTD
Power Precision Empowering Inovation
Sustainable Management
Integrity-based
Professional Services
About Us
Semiconductor Process Equipment & Advanced Packaging Solution Provider
ASMO Technology Co., Ltd. specializes in the development, manufacturing, and integration of semiconductor process equipment, providing high-efficiency and high-stability solutions to enhance yield and production performance.
Our product portfolio includes:
• Exposure Systems (Manual / Semi-auto / Fully-auto)
• Coating & Developing Systems
• Nano-level Inspection Systems
• Thin Film Process Equipment
• Advanced Packaging Equipment & Turnkey Solutions
We also offer customized equipment design and process integration services based on customer requirements.
Customer Base
重新定義先進封裝的成本與效率
ASMO Technology 專注於先進封裝設備與製程整合，具備完整自主研發、設備製造與量產導入能力。
透過自研 CeiP（Chip Embedded in Panel）先進封裝平台，採用面板級製程架構，結合高精度對位與高密度 RDL 技術，有效簡化傳統封裝流程，大幅降低製程複雜度與整體成本，同時提升良率與產能效率。
ASMO 提供從單機設備、製程開發到整線建置的一體化解決方案，協助客戶快
速導入先進封裝技術，打造具備競爭優勢的量產能力。
• Panel Level Advanced Packaging
• Embedded Die Integration
• High Density RDL Technology
• No Interposer Required
• No Micro-bump Process
• Reduced Process Steps
• High Yield Potential
• Turnkey Production Line Capability
★ 降低封裝成本 ★ 簡化製程流程 ★ 提升良率與穩定性 ★ 支援 AI / HPC / 高頻應用 ★ 高整合度封裝架構
ASMO 以技術為核心，整合設備與製程能力，致力成為先進封裝領域的關鍵解決方案提供者。
Customer Base
